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帅哥[离线]Jason_ye 楼主
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发短信 | 资料 | 引用 | 回复 发表于2009/12/15 14:26:281#
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最近研究CMMB,收录了很多公司的CMMB芯片的DataSheet,希望能够给正在研究CMMB的同学参考一下。
本人申明,所有的资料都来源于网络。

【文件名】:091215@52RD_ADMTV102_Rev.0.pdf
【格 式】:pdf
【大 小】:1062K
【简 介】:
The ADMTV102 is a highly integrated CMOS single chip zero-
IF conversion tuner IC for mobile-TV standards, such as DVBH,
DVB-T and DMB-TH. It includes dual RF input bands,
which are VHF and UHF. The building blocks of ADMTV102
are LNAs, RFPGAs, I/Q down-conversion mixers, bandwidth
adjustable low pass filters, baseband variable gain amplifiers,
VCOs and a fractional-N PLL, etc. On-chip low phase noise
VCO along with high resolution fractional-N frequency
synthesizer make in-band phase noise low enough for mobile-
TV applications.
【目 录】:
Features.................................................................................................. 1
Functional Block Diagram.................................................................. 1
Applications .......................................................................................... 1
General Description............................................................................. 1
Table of Contents.................................................................................. 2
Revision History................................................................................... 2
Specifications ........................................................................................ 3
Absolute Maximum Ratings ............................................................... 5
ESD Caution ..................................................................................... 5
Pin Configuration and Function Descriptions ................................ 6
Terminology.......................................................................................... 8
Typical Performance Characteristics................................................. 9
Functional Descriptions ....................................................................13
I2C Operation .................................................................................13
I2C Read/Write Address ................................................................13
I2C Bus Format ...............................................................................13
Timing Characteristics..................................................................14
I2C Register Map ............................................................................16
Detailed Register Description ......................................................18
RFAGC Setting ...............................................................................23
BBAGC Setting...............................................................................23
Theory of Operation..........................................................................24
RF LNA, PGA and I/Q Down-Converter...................................24
Local Oscillator...............................................................................24
PLL ...................................................................................................24
Baseband LPF and VGA................................................................24
Automatic Gain Control................................................................25
RFRSSI.............................................................................................25
Hardware/Software/Time-Slicing Power Down .......................26
Applications.........................................................................................27
RF Input Stage.................................................................................28
VCO Bias/Bypass Capacitors........................................................28
Digital Interface - I2C/Reset..........................................................28
Isolation from Digital Part............................................................28
BBVGA Interconnections .............................................................28
Reference Clock Selection.............................................................29
PLL Setting......................................................................................29
Three Power Down Modes ...........................................................30
Evaluation Board ................................................................................31
Evaluation Board Bill of Materials (BOM) .................................31
Evaluation Board Schematics .......................................................32
PCB Layers ......................................................................................33
Thermal Considerations ...............................................................34
Outline Dimensions ...........................................................................35
Recommended PCB Land Pattern ...................................................36
Ordering Guide ..............................................................................36
REVISION HISTORY

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【文件名】:091215@52RD_IF101_Datasheet_ver_202a.pdf
【格 式】:pdf
【大 小】:2052K
【简 介】:
The IF101 is a first generation single-chip OFDM
demodulator for Chinese Mobile Multimedia
Broadcast receiver system. It is low power,
multi-band demodulator for variety of mobile
Multimedia Broadcast reception devices, such as
mobile phone, PDA, PMP, Notebook and portable
digital TV device. The device provides optimal
echo performance making it ideal for operation in
the (Single Frequency Network) SFN and (Multi -
Frequency Networks) MFN environments.
【目 录】:
1 GENERAL DESCRIPTION..............................................................................................................................4
1.1 OVERVIEW....................................................................................................................................................4
1.2 APPLICATIONS ..............................................................................................................................................4
1.3 KEY FEATURES .............................................................................................................................................4
1.4 TYPICAL APPLICATION..................................................................................................................................5
2 PIN DESCRIPTIONS........................................................................................................................................6
2.1 PACKAGE/PINOUT DIAGRAMS.......................................................................................................................6
2.2 TQFN-128 PIN DESCRIPTIONS......................................................................................................................8
2.3 LFBGA-169 PIN ASSIGNMENT (PAD VIEW) ...............................................................................................13
3 FUNCTIONAL DESCRIPTIONS ...................................................................................................................14
3.1 CMMB DEMULTIPLEX (CMMB PART 2)......................................................................................................15
3.2 INTERFACE..................................................................................................................................................16
4 ON-CHIP MICROCONTROLLER ................................................................................................................24
5 APPLICATION CIRCUIT DIAGRAM..........................................................................................................25
6 ELECTRICAL CHARACTERISTICS...........................................................................................................26
6.1 ABSOLUTE MAXIMUM RATINGS...................................................................................................................26
6.2 DC ELECTRICAL CHARACTERISTICS............................................................................................................26
7 MECHANICAL SPECIFICATIONS ..............................................................................................................27
8 REGISTER DESCRIPTION...........................................................................................................................29
8.1 REGISTER LIST............................................................................................................................................29
8.2 REGISTER FUNCTION DESCRIPTION .............................................................................................................30
8.3 MMIS COMMAND LIST ...............................................................................................................................34
8.4 SDIO COMMAND LIST................................................................................................................................35
9 APPLICATION NOTES..................................................................................................................................36
9.1 DEMODULATOR DRIVER PROGRAMMING.....................................................................................................36
9.2 DEMUX PROGRAMMING.............................................................................................................................36

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【文件名】:091215@52RD_IF201Datasheet V1.1.1.pdf
【格 式】:pdf
【大 小】:2080K
【简 介】:
IF201 is the first generation highly integrated single-chip OFDM receiver for China Mobile
Multimedia Broadcast (CMMB) receiver system. including RF U-band Tuner and demodulator.
It Provides superior mobile performance with very low power consumption, and with
its high-level intergration, system manufacture can reduce number of the external
components used to further thrink the form factor.
【目 录】:
1, general description
2, Pin description
3,functional description
...

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【文件名】:091215@52RD_SMS1180_Data_Sheet_V1.0.pdf
【格 式】:pdf
【大 小】:678K
【简 介】:
SMS1180 is a highly integrated single chip
receiver (RF tuner and baseband) for Chinese
Mobile Digital TV (MDTV) applications – CMMB /
S-TIMI. It is a dual-band, low power and small
size solution, enabling TV reception in a variety
of handheld devices, such as mobile phones,
notebooks, navigation devices, UMPC’s, MID’s,
PDAs, portable video and media players and
more. The SMS1180 integrative and system
oriented design approach enables integrating the
CMMB mobile digital TV functionality to mobile
and handheld systems at a reduced system cost
and fast time to market.
【目 录】:
1 SMS1180 INTRODUCTION ................................................................................................. 8
1.1 KEY FEATURES...................................................................................................................... 9
1.2 BLOCK DIAGRAM.................................................................................................................. 9
1.3 MAIN FEATURES OF TUNER ............................................................................................... 11
1.3.1 DUAL BAND SUPPORT........................................................................................................ 11
1.3.2 FULLY INTEGRATED SOLUTION ......................................................................................... 11
1.3.3 ROBUST CLOCKING SYSTEM ............................................................................................. 11
1.3.4 ROBUST POWER SUPPLY CIRCUITRY.................................................................................. 11
1.3.5 GSP CONTROLLED............................................................................................................. 11
1.4 MAIN FEATURES OF DEMODULATOR ............................................................................... 11
1.4.1 CMMB (S-TIMI) SUPPORT................................................................................................ 11
1.4.2 MULTIPLE INTERFACES SUPPORT...................................................................................... 12
1.4.3 PWM................................................................................................................................ 12
1.5 FEATURES OF SMS1180 HOST API ................................................................................... 12
1.6 SYSTEM DATA FLOW.......................................................................................................... 13
2 POWERING THE SMS1180 ............................................................................................... 14
2.1 SCOPE ................................................................................................................................. 14
2.2 SMS1180 SUPPLIES............................................................................................................. 14
2.2.1 TUNER SUPPLIES................................................................................................................ 14
2.3 DEMODULATOR SUPPLIES .................................................................................................. 14
3 CLOCKING THE SMS1180 CHIP..................................................................................... 15
3.1 SCOPE ................................................................................................................................. 15
3.2 PHASE NOISE ....................................................................................................................... 15
3.3 REQUIREMENTS .................................................................................................................. 16
3.3.1 PHASE NOISE REQUIREMENT OF THE SOURCE ................................................................... 16
3.3.2 CRYSTAL ADDITIONAL REQUIREMENTS ............................................................................ 17
4 SMS1180 INTERFACE MODES ........................................................................................ 18
4.1 SCOPE ................................................................................................................................. 18
4.2 INTERFACING THE SMS1180 ............................................................................................. 18
4.3 SELECTING THE INTERFACE MODE .................................................................................. 20
4.4 USB MODE........................................................................................................................... 22
4.5 GSP CONTROL AND STATUS EXCHANGE .......................................................................... 23
4.6 SPI MODE ............................................................................................................................ 23
4.7 SDIO MODE......................................................................................................................... 25
4.8 PWM.................................................................................................................................. 27
5 RF FRONT END................................................................................................................... 28
5.1 SCOPE ................................................................................................................................. 28
5.2 ANTENNA............................................................................................................................ 29
5.2.1 UHF ANTENNA SPECIFICATION ......................................................................................... 29
5.2.2 S-BAND ANTENNA SPECIFICATION .................................................................................... 29
5.3 THE FILTER......................................................................................................................... 30
5.3.1 UHF FILTER SPECIFICATION NON GSM APPLICATION..................................................... 30
5.3.2 UHF FILTER SPECIFICATION IN GSM APPLICATION......................................................... 30
5.3.3 S-BAND FILTER SPECIFICATION ........................................................................................ 30
5.4 THE BALUN ......................................................................................................................... 31
5.5 RECOMMENDED RF FRONT END PARTS ............................................................................ 31
6 SMS1180 BOOT SEQUENCE............................................................................................. 32
6.1 SCOPE ................................................................................................................................. 32
6.2 BOOT PHASES ...................................................................................................................... 32
6.2.1 POWER UP.......................................................................................................................... 32
6.2.2 RESET ............................................................................................................................... 32
6.2.3 OS AND CLOCKS INITIALIZATION...................................................................................... 33
6.2.4 CODE DOWNLOAD ............................................................................................................. 34
6.2.5 EEPROM .......................................................................................................................... 34
6.2.6 USB.................................................................................................................................. 34
6.2.7 GSP .................................................................................................................................. 34
6.2.8 SPI.................................................................................................................................... 35
6.2.9 SDIO ................................................................................................................................ 35
6.2.10 PARALLEL INTERFACE BUS............................................................................................. 35
7 SMS1180 “POWER MODES”............................................................................................. 36
7.1 SCOPE ................................................................................................................................. 36
7.2 “POWER MODES” ............................................................................................................... 36
8 SMS1180 INTERFACES DRIVERS................................................................................... 37
8.1 SCOPE ................................................................................................................................. 37
8.2 SW ARCHITECTURE ........................................................................................................... 37
8.3 USB DRIVER........................................................................................................................ 38
9 DC CHARACTERISTICS................................................................................................... 39
9.1 ABSOLUTE MAXIMUM RATINGS ......................................................................................... 39
9.2 OPERATION TEMPERATURE ............................................................................................... 39
10 AC CHARACTERISTICS................................................................................................... 40
10.1 AC TEST CONDITIONS....................................................................................................... 40
10.2 RESET TIMING................................................................................................................... 40
10.3 SSP (SYNCHRONOUS SERIAL PORT) INTERFACE TIMING .............................................. 41
10.3.1 TI SSP MASTER............................................................................................................... 41
10.3.2 TI SSP SLAVE.................................................................................................................. 43
10.3.3 MOTOROLA SPI MASTER............................................................................................. 45
10.3.4 MOTOROLA SPI SLAVE................................................................................................ 47
10.4 SDIO INTERFACE TIMING ................................................................................................ 49
10.5 USB INTERFACE TIMING .................................................................................................. 50
11 SMS1180 PACKAGE INFORMATION............................................................................. 52
11.1 PACKAGE DATA ................................................................................................................ 52
11.2 PACKAGE TOP VIEW ........................................................................................................ 52
11.3 BALL ASSIGNMENT – BOTTOM VIEW............................................................................... 54
11.4 BALL ASSIGNMENT – TOP VIEW....................................................................................... 55
11.4.1 PIN-OUT DESCRIPTION .................................................................................................... 56
12 ORDERING INFORMATION............................................................................................ 61
12.1 STORAGE ........................................................................................................................... 61
12.2 ROHS................................................................................................................................ 61
GLOSSARY................................................................................................................................ 62

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【文件名】:091215@52RD_TP3001B Datasheet(v0.6).pdf
【格 式】:pdf
【大 小】:616K
【简 介】:
TP3001B is a baseband receiver that supports CMMB mobile TV standard. It can deliver CMMB mobile TV reception on all kinds of handheld devices together with a RF tuner.
【目 录】:
1 TP3001B Introduction....................................................................................5
1.1 Key Features.................................................................................................................6
1.2 Block Diagram...............................................................................................................6
2 Powering the TP3001B...................................................................................7
2.1 TP3001B Supplies........................................................................................................7
2.2 TP3001B Power Sequence and Reset Timing..............................................................7
2.3 TP3001B Power States and Power Modes...................................................................8
3 Clocking the TP3001B Chipset.....................................................................8
4 TP3001B Interface Modes..............................................................................9
4.1 Scope...........................................................................................................................9
4.2 SDIO Interface..............................................................................................................9
4.3 SPI Interface...............................................................................................................10
4.4 I2C Interface................................................................................................................12
5 RF Front End.................................................................................................13
6 TP3001B Boot Sequence.............................................................................13
6.1 Boot Phases................................................................................................................14
6.2 Power Up....................................................................................................................14
6.3 Reset..........................................................................................................................14
6.4 Code Download...........................................................................................................14
6.5 Firmware Initialization.................................................................................................14
7 TP3001B Interface Drivers...........................................................................15
7.1 Software Architecture..................................................................................................15
7.2 SDIO Driver.................................................................................................................17
7.3 SPI Driver....................................................................................................................17
7.4 Application Functions..................................................................................................17
8 TP3001B Package Information....................................................................18
8.1 Package Data..............................................................................................................18
8.2 Package View.............................................................................................................18
8.3 BGA Land Grid Assignment........................................................................................19
8.4 Pin-out Description......................................................................................................20
9 DC Characteristics.......................................................................................21
9.1 Absolute Maximum Ratings........................................................................................22
9.2 DC Characteristics and Operating Conditions............................................................22
10 Ordering Information...................................................................................23

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【文件名】:091215@52RD_TP3021Q Datasheet.pdf
【格 式】:pdf
【大 小】:868K
【简 介】:
This product is a Tuner and demodulator Module made for the CMMB (China mobile multimedia
broadcasting) service. This module includes a RF IC, a CMMB baseband demodulator IC, crystal and
all the required passive components. Designed and manufactured by Sharp’s advanced module
technology, this module has only 9mm x 9mm package size, and owns excellent sensitivity, mobility,
and immunity to interference performance (refer to chapter 4.3).
Since this module needs no external components, and has low power consumption, it can be fastly
designed in the cell phone, PMP and other handheld devices.
【目 录】:
1. Overview .......................................................................................................................................................... 6
2. General descriptions ......................................................................................................................................... 6
2.1 Receiving frequency............................................................................................................................... 6
2.2 RF input impedance................................................................................................................................ 6
2.3 Power supply voltage .............................................................................................................................. 6
2.4 Internal clock frequency .......................................................................................................................... 7
2.5 Channel selection system......................................................................................................................... 7
2.6 Transport parameter................................................................................................................................ 7
2.7 Module outline........................................................................................................................................ 8
2.8 Pin description........................................................................................................................................ 9
2.9 Circuit block diagram........................................................................................................................... 10
3. Environmental conditions and test conditions................................................................................................. 11
3.1 Temperature and humidity..................................................................................................................... 11
4. Electrical characteristics ................................................................................................................................. 11
4.1 Absolute maximum ratings .................................................................................................................... 11
4.2 Recommended operation conditions...................................................................................................... 11
4.3 Electrical characteristics ........................................................................................................................ 12
4.3.1 Sensitivity (typical)..................................................................................................................... 12
4.3.2 Current consumption .................................................................................................................. 13
4.3.3 Input/Output characteristics........................................................................................................ 14
5. Application circuit (Example) ......................................................................................................................... 15
5.1 Host CPU/AP/CP has 2 SPI interfaces available (recommend) ............................................................ 15
5.2 Host CPU/AP/CP has only 1 SPI interfaces available........................................................................... 16
5.3 Host CPU/AP/CP has only 1 SPI interface and extra flash available.................................................... 17
5.4 Main Component List........................................................................................................................... 18
6. Information of recommended module land pattern ......................................................................................... 19
7. Instructions ..................................................................................................................................................... 20
7.1 Instructions for mounting a module....................................................................................................... 20
7.2 Cautions for the static electricity........................................................................................................... 20
7.3 Instructions in repair of the mounted board........................................................................................... 20
7.4 Instructions in washing the module ....................................................................................................... 20
7.5 The other instructions ............................................................................................................................ 20
8. Interface Modes .............................................................................................................................................. 21
8.1 SDIO Interface...................................................................................................................................... 21
8.1.1 SD bus feature ............................................................................................................................ 21
8.1.2 SD bus command format ............................................................................................................ 21
8.2 SPI Interface ......................................................................................................................................... 23
8.2.1 SPI bus feature........................................................................................................................... 23
8.2.2 SPI bus command and response format ...................................................................................... 24
8.2.3 Command implementation.......................................................................................................... 28
TP3021Q Datasheet V0.0
________________________________________________________________________________________________________
– 4 –
Copyright© 2008 Telepath Technologies Co., Ltd.
8.4 Interface Register.................................................................................................................................. 30
8.4.1 Definition of special register ...................................................................................................... 30
8.5 Transfer process.................................................................................................................................... 32
8.5.1 Interface initialization................................................................................................................. 32
8.5.2 Data sending process .................................................................................................................. 34
8.5.3 Data reading process................................................................................................................... 35
8.6 Application layer .................................................................................................................................. 36
8.6.1 Data format ................................................................................................................................ 36
8.6.2 Control command protocol ......................................................................................................... 38
9. Packing Information ....................................................................................................................................... 44
9.1 Inner packing specifications .................................................................................................................. 44
9.2 Outer packing specifications ................................................................................................................. 45
9.3 Specifications for packing in the carton ................................................................................................ 46
10. Reliability Test.............................................................................................................................................. 47
11. Re-flow soldering conditions........................................................................................................................ 48

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【文件名】:091215@52RD_SC6600V Device Specifications.pdf
【格 式】:pdf
【大 小】:221K
【简 介】:
SC6600V is a highly integrated mixed signal Mobile TV processor. It provides CMMB demulator and
multi-media processing ability. For Mobile TV application, SC6600V requires minimum support from an
external controller.
【目 录】:
1 Overview ............................................................................................................................................. 5
1.1 General Description ...................................................................................................... 5
1.2 SC6600V Feature ......................................................................................................... 5
1.3 Applications................................................................................................................... 6
2 Pin Information .................................................................................................................................... 7
2.1 Pin Type Description ..................................................................................................... 7
2.2 Pin List by Pin Numbers................................................................................................ 7
2.3 Pin List by Functions ................................................................................................... 14
2.4 Package Pin Map........................................................................................................ 20
3 Electrical Specifications..................................................................................................................... 21
3.1 DC Specifications........................................................................................................ 21
3.1.1 Absolute Maximum Ratings ........................................................................................ 21
3.1.2 Recommended Operating Conditions......................................................................... 21
3.1.3 Thermal Characteristics .............................................................................................. 21
3.1.4 DC Characteristics ...................................................................................................... 21
3.2 AC Specifications ........................................................................................................ 22
3.2.1 RF RxADC Characteristic ........................................................................................... 23
3.2.2 26MHz Clock CLK_26M Timing.................................................................................. 23
3.2.3 Three-Wire Serial Interface Timing .................................................错误!未定义书签。
3.2.4 External Memory Interface Timing Diagrams..................................错误!未定义书签。
3.2.5 LCD Timing .....................................................................................错误!未定义书签。
3.2.6 BB LCM timing ................................................................................错误!未定义书签。
3.2.7 Power sequence .............................................................................错误!未定义书签。
4 Package Outline .....................................................................................................错误!未定义书签。
5 Reflow Profile .........................................................................................................错误!未定义书签。

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发短信 | 资料 | 引用 | 回复 发表于2009/12/18 10:01:238#
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谢谢楼主
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这么好的资源为什么没有人顶啊
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发短信 | 资料 | 引用 | 回复 发表于2009/12/21 13:08:2110#
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可能发的Datasheet太多了,下面给个索引:
ADMTV102-----------1楼
IF101-------------------2楼
IF201-------------------3楼
SMS1180--------------4楼
TP3001B--------------5楼
TP3021Q--------------6楼
SC6600V--------------7楼
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发短信 | 资料 | 引用 | 回复 发表于2009/12/22 12:29:5811#
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不错,顶一下~~
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发短信 | 资料 | 引用 | 回复 发表于2009/12/22 18:03:2012#
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可惜我回到草根时代了~~没钱
sanjee@163.com  楼主可否发一下 谢谢
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发短信 | 资料 | 引用 | 回复 发表于2009/12/24 10:16:3113#
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good!
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发短信 | 资料 | 引用 | 回复 发表于2009/12/24 16:09:5714#
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请问12#的需要哪个?
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发短信 | 资料 | 引用 | 回复 发表于2009/12/28 12:40:4915#
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顶一下!
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发短信 | 资料 | 引用 | 回复 发表于2010/1/4 9:56:4316#
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再顶一下!
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发短信 | 资料 | 引用 | 回复 发表于2010/1/18 10:06:0617#
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再顶一下!
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发短信 | 资料 | 引用 | 回复 发表于2010/1/18 15:30:0618#
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顶一下!
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发短信 | 资料 | 引用 | 回复 发表于2010/2/10 9:41:3019#
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顶一下!
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发短信 | 资料 | 引用 | 回复 发表于2010/2/11 14:53:1020#
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好人啊,楼主感谢你。花钱很值得!!!
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发短信 | 资料 | 引用 | 回复 发表于2010/2/11 15:14:1021#
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顶第2下
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发短信 | 资料 | 引用 | 回复 发表于2010/2/24 9:41:0722#
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顶LZ......
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发短信 | 资料 | 引用 | 回复 发表于2010/2/25 13:12:0623#
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我需要IF 202,有吗
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发短信 | 资料 | 引用 | 回复 发表于2010/2/26 9:35:3524#
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以下是引用dljg_df在2010-2-25 13:12:06的发言:
我需要IF 202,有吗

不好意思,IF202没有
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发短信 | 资料 | 引用 | 回复 发表于2010/3/3 14:49:5925#
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确实比较全啊
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发短信 | 资料 | 引用 | 回复 发表于2010/3/16 20:52:0326#
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樓主是個大好人,有需要再請教你
世界杯,关我"球"事
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发短信 | 资料 | 引用 | 回复 发表于2010/5/2 21:24:0827#
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支持,非常不错的资料
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发短信 | 资料 | 引用 | 回复 发表于2010/6/3 23:54:4828#
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顶一下——
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发短信 | 资料 | 引用 | 回复 发表于2010/6/7 0:25:2529#
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没钱啊   楼主发一下给我啊   yp.zhao@hotmail.com
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发短信 | 资料 | 引用 | 回复 发表于2010/6/13 15:39:1430#
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谢谢楼主了,花了我好多银子啊。。。。
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