| 招聘职位： | BSP Software Development Engineer |
| 职位描述： | Job Function • Develop and maintain board support package(BSP) software for smart phones. • Primary responsibilities including: o Low level driver design and enabling on smart phones. o Device bring-up and low level software integration |
| 职位要求： | Skills/Experience • Strong software design and debug skills with real-time/embedded systems • Master in ASM/C language • Expertise in driver development on RTOS, WinCE/WM, or Linux/Android platforms • Familiar with ARM architecture, ARM assembly and ARM-based SOC components • Familiar with QC chipset platform is a plus • Expertise in power management, secure boot loader or TrustZone is a strong plus • 3+ year work experience in embedded software development • Strong English communication and interpersonal skills • Ability to learn quickly, and must be a self-starter with high motivation Education Requirements: Bachelor's or Master's Degree in Computer Engineering, Computer Science, Electrical Engineering |
| 职位月薪： | 面议 |
| 职位地点： | 上海 |
| 更新日期： | 2012-3-5 |
| 有效期至： | 2012-6-4 |
| 公司名称： | 高通中国 (Qualcomm) |
| 公司简介： | 在1985年7月，7个行业资深高管聚集到了 Irwin Jacobs博士圣地亚哥的家讨论一个想法。这些梦想家们—Franklin Antonio、Adelia Coffman、Andrew Cohen、Klein Gilhousen、Irwin Jacobs、Andrew Viterbi和Harvey White—决定他们想要构建“高质量通信”并制定了一个计划，这个计划最后演变为通信行业最伟大的创业成功故事之一：高通公司。 高通公司成立之初主要为无线通讯业提供项目研究、开发服务，同时还涉足有... 详细 |
| 详细地址： | 中国北京朝阳区光华路1号 北京嘉里中心北楼2601 |
| 公司网站： | http://www.qualcomm.cn |